OHNISHI Osamu

写真a

Affiliation

Engineering educational research section Mechanical Intelligence Engineering Program

Title

Associate Professor

External Link
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Degree 【 display / non-display 】

  • 博士（工学） ( 1999.3   九州大学 )

  • 修士 ( 1996.3   九州大学 )

  • 学士 ( 1994.3   九州大学 )

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Research Areas 【 display / non-display 】

  • Manufacturing Technology (Mechanical Engineering, Electrical and Electronic Engineering, Chemical Engineering) / Manufacturing and production engineering

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Papers 【 display / non-display 】

  • Challenges of future high-precision polishing methods for hard-to-process materials by the fusion of environmental control and plasma technology Reviewed

    DOI K. Toshiro, AIDA Hideo, OHNISHI Osamu, YIN Shaohui, REN Yinghui

    Diamond & Abrasives Engineering   42 ( 6 )   637 - 649   2023.1

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    Language：English   Publishing type：Research paper (scientific journal)  

  • Development of a laser-guiding-type deep small-sized hole-measurement system: Measurement accuracy Reviewed

    Akio Katsuki, Takao Sajima, Hiroshi Murakami, Ali MdHazrat, Osamu Ohnishi, Kouji Akashi

    Precision Engineering   63   18 - 32   2020.5

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    Language：English   Publishing type：Research paper (scientific journal)  

  • Study on Fabrication of Electroplated Tools with High Performance: Influence of Conditions such as Stirring on Electroplated Layer Reviewed

    Osamu Ohnishi

    Transactions of MIRAI   7   28 - 31   2019.8

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    Language：English   Publishing type：Research paper (international conference proceedings)  

  • Challenges toward prospective precise polishing techniques by fusing environmental controlling and plasma technology Reviewed

    Hideo Aida，Osamu Ohnishi，Hidetoshi Takeda，Syuhei Kurokawa，Yasuhisa Sano，Toshiro Doi

    Proc. of the International Symposium on Advanced Plasma Science 2019   220 - 221   2019.3

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    Language：English   Publishing type：Research paper (international conference proceedings)  

  • Effects of Wire EDM Conditions on Slicing Performance for Silicon Reviewed

    Osamu Ohnishi, Toshiro Doi, Syuhei Kurokawa

    Transactions of MIRAI   4   30 - 35   2016.8

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    Language：English   Publishing type：Research paper (international conference proceedings)  

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Books 【 display / non-display 】

  • Handbook of Ceramics Grinding and Polishing

    Marinescu ほか（ Role： Joint author）

    William Andrew  2014.11 

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    Language：English Book type：Scholarly book

  • 先端LSI技術体系

    大西 修（分担執筆）（ Role： Sole author）

    グローバルネット  2012.12 

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    Book type：Scholarly book

  • 機械工学ハンドブック

    大西 修（分担執筆）（ Role： Sole author）

    朝倉書店  2011.9 

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    Book type：Scholarly book

  • 高付加価値のための精密研磨

    大西 修（分担執筆）（ Role： Contributor）

    日刊工業新聞社  2010.2 

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    Book type：Scholarly book

  • 図解　砥粒加工技術のすべて

    大西修（分担執筆）（ Role： Contributor）

    工業調査会  2006.8 

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    Book type：Scholarly book

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MISC 【 display / non-display 】

  • 機械工学年鑑

    久保司郎ほか

    日本機械学会誌   117 ( 1149 )   555 - 555   2014.8

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    Language：Japanese   Publishing type：Research paper, summary (national, other academic conference)   Publisher：日本機械学会誌  

  • 化合物半導体基板の研磨／CMP加工－加工メカニズムに基づくGaAs結晶とCdTe結晶のCMPスラリー－

    大西 修, 山崎 努, 會田 英雄, 黒河 周平, 土肥 俊郎

    砥粒加工学会誌   56 ( 9 )   596 - 599   2012.9

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    Language：Japanese   Publishing type：Research paper, summary (national, other academic conference)   Publisher：砥粒加工学会  

  • 半導体デバイスプロセスにおける超精密CMP技術の動向

    土肥 俊郎, 大西 修, 黒河 周平, 畝田　道雄, 山崎 努

    O plus E   34 ( 7 )   594 - 601   2012.9

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    Language：Japanese   Publishing type：Article, review, commentary, editorial, etc. (scientific journal)   Publisher：アドコム・メディア  

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Awards 【 display / non-display 】

  • 岩木賞（奨励賞）

    2024.2   未来生産システム学協会   　

    大西　修

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    Award type：Award from Japanese society, conference, symposium, etc.  Country：Japan

  • Excellent Research Award

    2019.8   The 12th MIRAI Conference on Microfabrication and Green Technology   Study on Fabrication of Electroplated Tools with High Performance: Influence of Conditions such as Stirring on Electroplated Layer

    Osamu OHNISHI

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    Award type：Award from international society, conference, symposium, etc.  Country：Japan

  • Excellent Paper Award

    2016.8   The 9th MIRAI Conference on Microfabrication and Green Technology   Effects of Wire EDM Conditions on Slicing Performance for Silicon

    Osamu OHNISHI, Toshiro DOI, Syuhei KUROKAWA

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    Award type：Award from international society, conference, symposium, etc.  Country：Japan

  • Excellent Poster Award

    2012.7   Review Commitee of Award, The Third International Conference on nanoManufacturing: nanoMan2012  

    Osamu OHNISHI, Toshiro DOI, Syuhei KUROKAWA, Kazuo TAKAHASHI, Fusao FUJITA, Hiroshi MIZUE, Yukihito KIDO

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    Award type：Award from international society, conference, symposium, etc.  Country：Japan

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Grant-in-Aid for Scientific Research 【 display / non-display 】

  • バブルアイスプレートを用いた研磨加工に関する研究

    Grant number：23K03605  2023.04 - 2026.03

    独立行政法人日本学術振興会  科学研究費補助金  基盤研究(C)

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    Authorship：Principal investigator 

  • 次世代型マルチレンジ対応純氷ブロック砥石の開発

    Grant number：18K03877  2018.04 - 2022.03

    科学研究費補助金  基盤研究(C)

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    Authorship：Principal investigator 

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